Basic theory and microscopic study of copper foil

DeFu Technology, with decades of technological expertise, has made significant advancements in key areas such as the correlation between the microstructural properties and physical properties of copper foils, the study of material stress and elastic modulus characteristics, and the development of theoretical models for copper foil roughness. The performance of electrolytic copper foils is influenced by their own crystal structure. However, by appropriately regulating the additives during the electrolytic process, it is possible to change the deposition potential of copper, thereby affecting the microstructure and morphology of the copper foil.

To address the trend of lightweight and thin PCB boards, as well as the low transmission loss characteristics of high-frequency and high-speed circuits, DeFu Technology has developed polymer-based additives. These additives are specifically designed to customize the copper nodules on the surface of copper foils. This technology simultaneously achieves low roughness and sufficient peel strength, making it a key aspect of copper foil manufacturing technology.

In electronic circuit copper foils, the presence of a metal barrier layer can introduce factors that impede signal transmission, which can be further amplified in high-speed PCBs. To address this issue, a low ferromagnetic metal barrier layer has been developed, which helps to reduce signal transmission losses to some extent. By using a low ferromagnetic metal as the barrier layer, the unwanted magnetic interference that could negatively affect signal integrity is minimized, resulting in improved signal transmission performance in high-speed PCB applications.

According to customer demands, a targeted development of silicon coupling agent adaptation technology has been carried out, aiming to enhance the chemical bonding performance between copper foils and various types of high-frequency and high-speed resin substrates.